Currently we are extending CoolSPICE to integrate thermal
and electrical simulations into a self-consistent
The electrical performance of semiconductor devices is
significantly dependent on their operating temperatures.
At the same time, the power consumption of each device and
the physical arrangement of devices, packaging and heat sinks
within the system determines the operating temperature of each
device. We plan to model this feedback loop using a self-consistent
simulation system, where the electrical and thermal models of a
system are simulated alternately, the results of each simulation
refining the input conditions of the other until convergence
Since thermal management is critical in the design of high
power systems, the ability to do joint electro-thermal simulation
is a great advantage in terms of rapid-turnaround design.
For electrical simulations, we are building a library of model
cards for specialized SiC power devices for use with the modified
SPICE engine of CoolSPICE. Similarly, we are building a library
of the thermal characteristics of devices in different packaging
and of different components such as common heat sinks in order to
generate and simulate an equivalent thermal circuit self-consistently
with a corresponding electrical circuit.
We are working towards the implementation of models which will
take into account various boundary conditions, enclosures,
convection and radiation etc.